HIGH ELECTRICAL PERFORMANCE SILICON GEL

Resistant to corrosion, high and low temperatures, insulating and pressure-resistant, high elastic recovery, etc. Can cure at room temperature and heating.with the characteristic of faster curing at higher temperatures. No by-productsreleased during curing, complies with EU ROHS, MSDS directives,

HIGH THERMAL CONDUCTIVITY SEALING ADHESIVE

Insulating, moisture-proof, shock-resistant, pressure-resistant, thermallyconductive, ensuring safe operation of electronic components under harshconditions. Room temperature curing, no substance release during curingrapid curing after heating, forming repairable, thermally conductive siliconeelastomer. Environmentally friendly and non-toxic, complies with EU ROHSMSDS directives.

UV RESISTANT EPOXY RESIN

Low viscosity, good fluidity, easy to penetrate product gaps,good adhesion, corrosion-resistant. No bubbles, high strength,smooth surface after curing; long-term non-discoloration,complies with ROHS, MSDS directives. Suitable for encapsulationofvarious electronic components.